Copper surface roughening treatment device - Micro-etching device
It is possible to stably transport workpieces with a thickness of 50 μm, and it is also compatible with FPC transport.
The copper surface roughening treatment device, micro-etching device, is a surface treatment device capable of stably transporting workpieces with a thickness of 50 μm. The fine specification nozzle pattern and oscillation mechanism enable uniform surface accuracy. The upper etching is individually pressure-controlled for even higher precision. For more details, please contact us or refer to the catalog.
- Company：二宮システム
- Price：Other
